Phosphor composition and light emitting diode device using the same

ABSTRACT

A phosphor composition is provided. The phosphor composition comprises a phosphor nucleus and a hydrophobic layer. The hydrophobic layer is bonded on a surface of the phosphor nucleus and consists of an organic compound with a hydrophobic functional group.

This application claims the benefit of Taiwan application Serial No.101143476, filed Nov. 21, 2012, the subject matter of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates in general to a light emitting structure, and moreparticularly to a phosphor composition and a light emitting diode (LED)device using the same.

2. Description of the Related Art

The light emitting structure which emits a light using the properties ofphosphors has been used for decades, and more than 30 varieties ofphosphors have been developed and put into use. In recent years, thephosphors formed by rare earth oxides with high quantum efficiency andchemical stability have been widely used in the illumination and displayindustries and its significance goes without saying. The commonly usedrare earth phosphors include yttrium aluminum garnet (YAG, Y₃Al₅O₁₂)phosphor and terbium aluminum garnet (TAG, Tb₃Al₅O₁₂) phosphor.

In the field of light emitting diode (LED), phosphor is used foremitting a white light by exciting a yellow phosphor with ahigh-brightness blue light LED or exciting a red phosphor and a greenphosphor with a high-brightness blue light LED. Or, the red, the green,and the blue phosphors can be excited with a UV-light LED to generate awhite light. However, in an environment of high temperature and highhumidity, phosphors are susceptible to the influence of temperature andhumidity, and problems such as color shift and shortened lifespan mayoccur and affect the emission efficiency of the white light LED deviceand result in color shift.

SUMMARY OF THE INVENTION

The invention is directed to a phosphor composition and a light emittingdiode (LED) device using the same for increasing reliability.

According to an embodiment of the present invention, a phosphorcomposition is provided. The phosphor composition comprises a phosphornucleus and a hydrophobic layer. The hydrophobic layer is bonded on asurface of the phosphor nucleus and consists of an organic compound witha hydrophobic functional group.

According to another embodiment of the present invention, a lightemitting diode (LED) device is provided. The LED device comprises an LEDchip and a phosphor composition. The LED chip emits a first light withwavelength λ1. The phosphor composition comprises a phosphor nucleus anda hydrophobic layer. The hydrophobic layer is bonded on a surface of thephosphor nucleus and consists of an organic compound with a hydrophobicfunctional group. The phosphor composition, being irradiated by thelight with wavelength λ1, emits a second light with wavelength λ2 mixedwith the first light to form a white light spectrum, wherein λ2>λ1.

The above and other aspects of the invention will become betterunderstood with regard to the following detailed description of thepreferred but non-limiting embodiments. The following description ismade with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic diagram of a phosphor composition according toan embodiment of the invention;

FIG. 2 shows a molecular structural diagram of alkylsilyl halideaccording to an embodiment of the invention;

FIGS. 3A˜3C show schematic diagrams of an LED device according to anembodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

According to a phosphor composition of the present embodiment and an LEDdevice using the same, a surface of the phosphor nucleus is modifiedwith a hydrophobic functional group to increase the reliability. Forexample, the modified surface of the phosphor composition has ahydrophobic layer, which avoids the phosphor composition deterioratingeasily in an environment of high temperature and high humidity, andreducing the sensitivity of the phosphor composition to temperature andhumidity. Therefore, when the phosphor composition is used in anenvironment of high temperature and high humidity, the phosphorcomposition has better temperature stability, higher humidityresistance, and longer lifespan. Moreover, when the phosphor compositionis used in the packaging of LED, the molecules of the modified phosphorcomposition do not cluster easily, and can be uniformly distributed toprovide higher stability and reduce color shift and light decay.Therefore, the brightness of the LED device decays unapparently evenafter a long duration of use, and the color tone of the light emitted bythe LED device is less likely to be shifted.

A number of embodiments are disclosed below for elaborating theinvention. However, the embodiments of the invention are for detaileddescriptions only, not for limiting the scope of protection of theinvention.

The phosphor composition of the present embodiment can be formed by thesolid-state reaction method or the sol-gel method, and then can befurther grinded into phosphor powders whose particle size is micrometerlevel or nanometer level. The surface of the phosphor nucleus and anorganic compound with a hydrophobic functional group can be combined toform a phosphor composition.

Referring to FIG. 1, a schematic diagram of a phosphor composition 100according to an embodiment of the invention is shown. The phosphorcomposition 100 comprises a phosphor nucleus 110 and a hydrophobic layer120. The hydrophobic layer 120 is bonded on a surface 112 of thephosphor nucleus 110 and consists of an organic compound 122 with ahydrophobic functional group 126. For example, the hydrophobic layer 120is an alkylsilyl halide with a C_(n)F_(2n+1) functional group whosechemical formula can be expressed as:C_(n)F_(2n+1)C₂H₄Si(OC_(m)H_(2m+1))₃, wherein 4≦n≦16, 0≦m≦4, and n, mare integers. In the present embodiment, the hydrophobic functionalgroup 126 is realized by the C_(n)F_(2n+1) functional group, such thatthe modified phosphor composition 100 can be used in an environment ofhigh temperature and high humidity.

Referring to FIG. 2, a molecular structural diagram of alkylsilyl halideaccording to an embodiment of the invention is shown. In the presentembodiment, the alkylsilyl halide is an organic silicon compound. Oneend of the alkylsilyl halide reacts with phosphor through silane 124 tobe bonded on the surface 112 of the phosphor nucleus 110; the other endaway from the surface of the phosphor nucleus 110 is realized by ahydrophobic functional group 126, such that the hydrophilic functionalgroup of the phosphor nucleus 110 does not contact water molecules inthe environment easily and the humidity resistance of the phosphornucleus 110 can be increased.

Details of the method of forming the hydrophobic layer 120 on thephosphor nucleus 110 are disclosed below. A powdered fluorescentmaterial is distributed in an organic solvent (such as ethanol)containing alkylsilyl halide and a catalyst and then is heated andrefluxed such that the alkylsilyl halide can be bonded on the surface112 of the phosphor nucleus 110. After the fluorescent material iscooled, the fluorescent material is further filtered and cleaned with anorganic solvent. Then, a 150° C. heat treatment is applied on thefluorescent material to obtain a hydrophobic layer 120 bonded on asurface of the phosphor nucleus 110. Preferably, the alkylsilyl halideof the present embodiment is 1H, 1H, 2H,2H-perfluoro-octylethyltrimethoxy silane.

In the above embodiment, the hydrophobic layer 120 is formed by thealkylsilyl halide. In another embodiment, the hydrophobic layer 120 isformed by a haloalkene compound with a hydrophobic functional group. Thehaloalkene compound can use an organic compound, such aspoly(tetrafluoroethylene) (PTFE), as a reaction gas, and can be directlycoated on the surface 112 of the phosphor nucleus 110 such that thehydrophilic functional group of the phosphor nucleus 110 does not easilycontact water molecules in the environment and the humidity resistanceof the phosphor nucleus 110 can be increased.

The hydrophobic layer 120 disclosed above is a nanometer level organiccompound 122 whose thickness is not larger than 10 nanometers, forexample. Preferably, the thickness of the hydrophobic layer 120 rangesbetween 0.1˜3 nanometers.

The phosphor nucleus 110 of the present embodiment can be selected fromone or a combination of the groups consisting of the following compoundswhose chemical formulas are expressed as follows

Ca_(1−x)Al_(x−xy)Si_(1−x+xy)N_(2−x−xy)C_(xy):A;  (1)

Ca_(1−x−z)Na_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (2)

M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (3)

M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3)C_(xy)O_(w−v/2)H_(v):A;  (4)

M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3−v/3)C_(xy)O_(w)H_(v):A;  (5)

wherein 0<x<1, 0<y<1, 0≦z<1, 0≦v<1, 0<w<1, x+z<1, x>xy+z and 0<x−xy−z<1,

M(I) is at least a univalent positive ion which comprises a metal ionsuch as Li, Na, K, Rb, Cu, Ag or Au;

M(II) is at least a divalent positive ion which comprises a metal ionsuch as Be, Mg, Ca, Sr, Ba, Cu, Co, Ni, Pd or Zn;

M(III) is at least a trivalent positive ion which comprises a metal ionsuch as B, Al, Ga, In, Sc, Y, La or Gd;

H is at least a univalent negative ion which comprises a halogen ionsuch as F, Cl, Br or I;

A is selected from activators consisting of metal ions which comprisesat least a metal ion such as Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm,Yb, Lu, Mn, Bi or Sb.

Besides, the phosphor nucleus 110 of the present embodiment can beselected from one or a combination of the groups consisting of thefollowing compounds whose chemical formulas are expressed as follows:

M(II)_(a)Si_(b)O_(c)N_(d)C_(e):A, wherein 6<a<8, 8<b<14, 13<c<17, 5<d<9,0<e<2;  (1)

M(II)₇Al_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12, 0<y<x,0<x+y≦12;  (2)

M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12,0<y<x, 0<x+y≦12;  (3)

M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±3δ/2)N_(x∓δ−y)C_(y):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (4)

M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±δ/2)N_(x∓δ−y)C_(y±δ/2):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (5)

M(II)_(7−y)M(I)_(y)M(III)_(12−x−y)Si_(x+y+z)O_(25−x±3δ/2)N_(x∓δ−z)C_(z):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (6)

M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2)N_(x∓δ−z)C_(z±δ/2):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (7)

M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−z±3δ/2−v/2)N_(x∓δ−z)C_(z)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12; and  (8)

M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2−v/2)N_(x∓δ−z)C_(z±δ/2)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12;wherein  (9)

M(I) is at least a univalent positive ion which comprises a metal ionsuch as Li, Na, K, Rb, Cu, Ag or Au;

M(II) is at least a divalent positive ion which comprises a metal ionsuch as Be, Mg, Ca, Sr, Ba, Cu, Co, Ni, Pd or Zn;

M(III) is at least a trivalent positive ion which comprises a metal ionsuch as B, Al, Ga, In, Sc, Y, La or Gd;

H is at least a univalent negative ion which comprises a halogen ionsuch as F, Cl, Br or I;

A is selected from activators consisting of metal ions which comprisesat least a metal ion such as Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm,Yb, Lu, Mn, Bi or Sb.

The phosphor composition 100 is used in an LED device to generate aluminescence spectrum. For example, the LED device emits a first lightwith wavelength λ1 as an excited light irradiating the phosphorcomposition 100. The phosphor composition 100, having been irradiated bythe first light with wavelength λ1, emits a second light with wavelengthλ2, wherein λ2>λ1. If the LED device emits a blue light whose wavelengthranges between 445˜475 nanometers to excite a yellow phosphorcomposition, the blue light and the yellow light can be mixed to producea white light spectrum. If the LED device emits a UV light whosewavelength ranges between wavelength 430˜350 nanometers to excite a red,a green, and a blue phosphor composition, the red light, the green lightand the blue light can be mixed to produce a white light spectrum.

Referring to FIGS. 3A˜3C, schematic diagrams of an LED devices 140˜142according to an embodiment of the invention are shown. The LED device140 comprises an LED chip 130, a colloid 134 and a phosphor composition100 (only the phosphor nucleus 110 is illustrated, and the hydrophobiclayer 120 bonded on a surface of the phosphor nucleus 110 is notillustrated). The LED chip 130 is a blue light chip, for example. Thephosphor composition 100 located above a light emitting surface 132 ofthe LED chip 130 absorbs light energy to enter an excited state and isimmediately de-excited to emit a fluorescent light. As indicated in FIG.3A, the phosphor composition 100 can be directly coated on the surface132 of the LED chip 130, and then is encapsulated with the colloid 134.As indicated in FIG. 3B, the phosphor composition 100 can be mixed inthe colloid 134 d used for packaging the LED chip 130, and then thesurface 132 of the LED chip 130 is covered by the colloid 134. Asindicated in FIG. 3C, the phosphor composition 100 can be coated on aplate 136 located above the light emitting surface 132 of the LED chip130. The plate 136 is a diffuser, a condensing lens, a lens, a prism ora filter, and the invention does not have particular restrictionsregarding the varieties of the plate 136.

Besides, the colloid 134 can be a resin such as epoxy or silicone. Thecolloid 134 can resist the penetration of moisture or heat, such thatthe phosphor composition 100 mixed in the colloid 134 can be used in anenvironment of high temperature and high humidity.

As indicated in FIG. 1, the organic compound 122 with a hydrophobicfunctional group 126 is bonded on the surface 112 of the phosphornucleus 110, the molecules of the phosphors mixed in the colloid 134 ofthe present embodiment do not cluster easily and can be uniformlydistributed to provide higher stability and reduce color shift and lightdecay. Therefore, the brightness of the LED device of the presentembodiment decays unapparently after a long duration of use, and thecolor tone of the light emitted by the LED device is less likely to beshifted.

While the invention has been described by way of example and in terms ofthe preferred embodiment(s), it is to be understood that the inventionis not limited thereto. On the contrary, it is intended to cover variousmodifications and similar arrangements and procedures, and the scope ofthe appended claims therefore should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements and procedures.

What is claimed is:
 1. A phosphor composition, comprising: a phosphornucleus, and a hydrophobic layer bonded on a surface of the phosphornucleus and consisting of an organic compound with a hydrophobicfunctional group.
 2. The phosphor composition according to claim 1,wherein the organic compound is selected from a group consisting ofhaloalkene compound or alkylsilyl halide.
 3. The phosphor compositionaccording to claim 2, wherein a chemical formula of the alkylsilylhalide is expressed as: C_(n)F_(2n+1)C₂H₄Si(OC_(m)H_(2m+1))₃, 4≦n≦16,0≦m≦4, and n, m are integers.
 4. The phosphor composition according toclaim 2, wherein the haloalkene compound comprisespoly(tetrafluoroethylene) (PTFE).
 5. The phosphor composition accordingto claim 1, wherein a thickness of the hydrophobic layer is not largerthan 10 nanometers.
 6. The phosphor composition according to claim 5,wherein a thickness of the hydrophobic layer ranges between 0.1˜3nanometers.
 7. The phosphor composition according to claim 1, whereinthe phosphor nucleus is selected from one or a combination of the groupsconsisting of the following compounds whose chemical formulas areexpressed as:Ca_(1−x)Al_(x−xy)Si_(1−x+xy)N_(2−x−xy)C_(xy):A;  (1)Ca_(1−x−z)Na_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (2)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (3)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3)C_(xy)O_(w−v/2)H_(v):A;  (4)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3−v/3)C_(xy)O_(w)H_(v):A;  (5)0<x<1, 0<y<1, 0≦z<1, 0≦v<1, 0<w<1, x+z<1, x>xy+z and 0<x−xy−z<1, M(I) isat least a univalent positive ion which comprises a metal ion being Li,Na, K, Rb, Cu, Ag or Au; M(II) is at least a divalent positive ion whichcomprises a metal ion being Be, Mg, Ca, Sr, Ba, Cu, Co, Ni, Pd or Zn;M(III) is at least a trivalent positive ion which comprises a metal ionbeing B, Al, Ga, In, Sc, Y, La or Gd; H is at least a univalent negativeion which comprises a metal ion being F, Cl, Br or I; A is selected fromactivators consisting of a metal ion being Ce, Pr, Nd, Sm, Eu, Gd, Tb,Dy, Ho, Er, Tm, Yb, Lu, Mn, Bi or Sb.
 8. The phosphor compositionaccording to claim 1, wherein the phosphor nucleus is selected from oneor a combination of the groups consisting of the following compoundswhose chemical formulas are expressed as:M(II)_(a)Si_(b)O_(c)N_(d)C_(e):A, wherein 6<a<8, 8<b<14, 13<c<17, 5<d<9,0<e<2;  (1)M(II)₇Al_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12, 0<y<x,0<x+y≦12;  (2)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12,0<y<x, 0<x+y≦12;  (3)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±3δ/2)N_(x∓δ−y)C_(y):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (4)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±δ/2)N_(x∓δ−y)C_(y±δ/2):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (5)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y)Si_(x+y+z)O_(25−x±3δ/2)N_(x∓δ−z)C_(z):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (6)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2)N_(x∓δ−z)C_(z±δ/2):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (7)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−z±3δ/2−v/2)N_(x∓δ−z)C_(z)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12; and  (8)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2−v/2)N_(x∓δ−z)C_(z±δ/2)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12;wherein  (9) M(I) is at least a univalent positive ion which comprises ametal ion being Li, Na, K, Rb, Cu, Ag or Au; M(II) is at least adivalent positive ion which comprises a metal ion being Be, Mg, Ca, Sr,Ba, Cu, Co, Ni, Pd or Zn; M(III) is at least a trivalent positive ionwhich comprises a metal ion being B, Al, Ga, In, Sc, Y, La or Gd; H isat least a univalent negative ion which comprises a metal ion being F,Cl, Br or I; A is selected from activators consisting of a metal ionbeing Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Mn, Bi or Sb.9. A light emitting diode (LED) device, comprising: an LED chip foremitting a first light with wavelength λ1; and a phosphor compositioncomprising a phosphor nucleus and a hydrophobic layer, wherein thehydrophobic layer is bonded on a surface of the phosphor nucleus andconsists of an organic compound with a hydrophobic functional group, andthe phosphor composition, being irradiated by the first light withwavelength λ1, emits a second light with wavelength λ2 mixed with thefirst light with wavelength λ1 to form a white light spectrum, andλ2>λ1.
 10. The LED device according to claim 9, wherein the phosphorcomposition is located above a light emitting surface of the LED chip.11. The LED device according to claim 10, wherein the phosphorcomposition is directly coated on a surface of the LED chip, mixed in acolloid sued for packaging the LED chip or coated on a plate locatedabove a light emitting surface of the LED chip.
 12. The LED deviceaccording to claim 11, wherein the colloid can be formed by epoxy orsilicone.
 13. The LED device according to claim 9, wherein the organiccompound is selected from a group consisting of haloalkene compound oralkylsilyl halide.
 14. The LED device according to claim 13, wherein achemical formula of the alkylsilyl halide is expressed as:C_(n)F_(2n+1)C₂H₄Si(OC_(m)H_(2m+1))₃, 4≦n≦16, 0≦m≦4, and n, m areintegers.
 15. The LED device according to claim 13, wherein thehaloalkene compound comprises poly(tetrafluoroethylene) (PTFE).
 16. TheLED device according to claim 9, wherein a thickness of the organiccompound is not larger than 10 nanometers.
 17. The LED device accordingto claim 16, wherein a thickness of the organic compound is between0.1˜3 nanometers.
 18. The LED device according to claim 9, wherein thephosphor nucleus is selected from one or a combination of the groupsconsisting of the following compounds whose chemical formulas areexpressed as:Ca_(1−x)Al_(x−xy)Si_(1−x+xy)N_(2−x−xy)C_(xy):A;  (1)Ca_(1−x−z)Na_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (2)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy)C_(xy):A;  (3)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3)C_(xy)O_(w−v/2)H_(v):A;  (4)M(II)_(1−x−z)M(I)_(z)M(III)_(x−xy−z)Si_(1−x+xy+z)N_(2−x−xy−2w/3−v/3)C_(xy)O_(w)H_(v):A;  (5)wherein 0<x<1, 0<y<1, 0≦z<1, 0≦v<1, 0<w<1, x+z<1, x>xy+z and 0<x−xy−z<1,M(I) is at least a univalent positive ion which comprises a metal ionbeing Li, Na, K, Rb, Cu, Ag or Au; M(I) is at least a divalent positiveion which comprises a metal ion being Be, Mg, Ca, Sr, Ba, Cu, Co, Ni, Pdor Zn; M(III) is at least a trivalent positive ion which comprises ametal ion such as B, Al, Ga, In, Sc, Y, La or Gd; H is at least aunivalent negative ion which comprises a halogen ion being F, Cl, Br orI; A is selected from activators consisting of metal ions whichcomprises at least a metal ion being Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho,Er, Tm, Yb, Lu, Mn, Bi or Sb.
 19. The LED device according to claim 9,wherein the phosphor nucleus is selected from one or a combination ofthe groups consisting of the following compounds whose chemical formulasare expressed as:M(II)_(a)Si_(b)O_(c)N_(d)C_(e):A, wherein 6<a<8, 8<b<14, 13<c<17, 5<d<9,0<e<2;  (1)M(II)₇Al_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12, 0<y<x,0<x+y≦12;  (2)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x)N_(x−y)C_(y):A, wherein 0<x≦12,0<y<x, 0<x+y≦12;  (3)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±3δ/2)N_(x∓δ−y)C_(y):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (4)M(II)₇M(III)_(12−x−y)Si_(x+y)O_(25−x±δ/2)N_(x∓δ−y)C_(y±δ/2):A, wherein0<x<12, 0≦y<x, 0<x+y≦12, 0<δ≦3, δ<x+y;  (5)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y)Si_(x+y+z)O_(25−x±3δ/2)N_(x∓δ−z)C_(z):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (6)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2)N_(x∓δ−z)C_(z±δ/2):A,wherein 0<x<12, 0≦y<x, 0<z<x, 0<x+y+z≦12, z<x+δ, 0<δ≦3;  (7)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−z±3δ/2−v/2)N_(x∓δ−z)C_(z)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12; and  (8)M(II)_(7−y)M(I)_(y)M(III)_(12−x−y−z)Si_(x+y+z)O_(25−x±δ/2−v/2)N_(x∓δ−z)C_(z±δ/2)H_(v):A,wherein 0<x<12, 0≦y<1, 0<z<x, z<x+δ, 0<δ≦3, 0≦v<1, 0<x+y+z≦12;wherein  (9) M(I) is at least a univalent positive ion which comprises ametal ion being Li, Na, K, Rb, Cu, Ag or Au; M(II) is at least adivalent positive ion which comprises a metal ion being Be, Mg, Ca, Sr,Ba, Cu, Co, Ni, Pd or Zn; M(III) is at least a trivalent positive ionwhich comprises a metal ion being B, Al, Ga, In, Sc, Y, La or Gd; H isat least a univalent negative ion which comprises a halogen ion being F,Cl, Br or I; A is selected from activators consisting of metal ionswhich comprises at least a metal ion being Ce, Pr, Nd, Sm, Eu, Gd, Tb,Dy, Ho, Er, Tm, Yb, Lu, Mn, Bi or Sb.
 20. The LED device according toclaim 9, wherein the LED chip is a blue light chip.